Subsurface imaging of grain microstructure using picosecond ultrasonics
نویسندگان
چکیده
منابع مشابه
Thin-film Thermal Conductivity and Thickness Measurements Using Picosecond Ultrasonics
A method utilizin g picosecond u ltrason ics, combin ed with a pump-probe therm oreflectance techn iqu e, for the sim u ltan eou s m easu rem ent of thin -film th ickness and thermal condu ctiv ity norm al to the su rface is presen ted. Th is techniqu e is a non con tact m ethod that is u sefu l for determ in in g thermophysica l properties of film s with th ickness grad ien ts or for film s in...
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ژورنال
عنوان ژورنال: Acta Materialia
سال: 2016
ISSN: 1359-6454
DOI: 10.1016/j.actamat.2016.04.003